Shanghai Plastics Research Institute
Main products:FEP Rod,FEP Film,PFA Products,PTFE Heat Shrinkable Sleeve
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Contact Us
  • Contact Person : Mr. Sheng Yifan
  • Company Name : Shanghai Plastics Research Institute
  • Tel : 86-21-65193209
  • Fax : 86-21-65193209
  • Address : Shanghai,Shanghai,1664 Yangshupu Road, Yangpu District
  • Country/Region : China
  • Zip : 200090

PTFE Copper Clad Laminate

PTFE Copper Clad Laminate
Product Detailed
PTFE Copper Clad Laminate 1.Copper Clad Laminate of PTFE 2.It has excellent electrical, mechanical and heat-resistant propert

PTFE Copper Clad Laminate

PTFE Copper Clad Laminate

The copper clad laminate is made from PTFE impregnated glass cloth and copper by heat pressing technique. It has excellent electrical, mechanical and heat-resistant property. It can be used as printed circuit board in radio at high frequency and in E/E devices. It conforms to the enterprise standard of Q/GHAD 5 -2007.

  

Specification

                                                                                      Unitmm

No

Code

Thickness

Area

1

CTFGCSD025

0.25±0.02

300×440or500×500or520×520

2

CTFGCSD050

0.50±0.03

3

CTFGCSD080

0.80±0.04

4

CTFGCSD100

1.0±0.04

5

CTFGCSD125

1.25±0.05

6

CTFGCSD150

1.5±0.07

7

CTFGCSD200

2.0±0.07

8

CTFGCSD250

2.5±0.07

9

CTFGCSD300

3.0±0.10

10

CTFGCSD500

5.0±0.15

Note: 1.CTFGCS is double side sheet, CTFGCD is one side sheet.           2 Customers request negotiable

  

Main Properties

  

No

Item

Condition

Value

1

Surface Resistivity Ω

Normal

≥1×1010

Wet

≥1×109

2

Resister between pins/Ω

Normal

≥1×1011

Wet

≥1×109

3

Surface Dielectric Strength Mv/m

Normal

≥1.2

Wet

≥1.1

4

Dissipation Factor106HZ

Normal

≤0.001

Wet

≤0.008

5

Dielectric Constant106HZ

Normal

2.50~3.00*

6

Peel Strength N/cm

Normal

≥15

Pre-processing

≥13

After Dip Soldering

≥13

7

Dip Soldering-resistance

No delamination ,No Bubble

Note: Customers request negotiable

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